PURPOSE: To provide the present composition outstanding in heat and impact resistances and flame retardancy, to be used as a material for parts of electronic devices, etc., comprising a heat-resistant resin, a thermoplastic resin, antimony oxide, a bromine-contg. epoxy compound and a vinyltrialkoxysilane.
CONSTITUTION: The objective resin composition good in moldability, capable of giving molded products of outstanding gloss and weatherability and of little discoloration can be obtained by incorporating a total of 100pts.wt. of (A) 10-50wt.% based on the components A+B, of a heat-resistant resin produced from (i) a styrene compound and (ii) 5-50wt.% based on the components (i)+(ii), of an imide compound from an α,β-unsaturated dicarboxylic acid, and (B) a thermoplastic resin (e.g., containing 5-35wt.% of a rubber reinforcer such as butadiene rubber), with (C) 0.5-10pts.wt. of antimony oxide, (D) 5.0-40pts.wt. of a bromine-contg. epoxy compound with an average molecular weight of 1,200-6,000 and bromine content of 5.0-52wt.%, and (E) 0.1W5.0pts.wt. of a vinyltrialkoxysilane.
| JPH09194719 | RESIN COMPOSITION |
| WO/1998/033853 | POLYSTYRENIC RESIN COMPOSITION, ANTI-FLAME COMPOSITION THEREOF AND METHODS FOR THE PREPARATION THEREOF |
| WO/2020/095468 | FLAME RETARDANT LOW HARDNESS MATERIAL |
AOYAMA TSUTOMU
SHIRAKAWA KATSUSHI
YASUDA TETSUO
