Title:
半導体用樹脂組成物、半導体用接着剤、接着フィルム、これを用いたリードフレーム及び半導体装置
Document Type and Number:
Japanese Patent JP3988058
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain an adhesive member for improving wire-bonding work, esp. a heat-resistant adhesive suitable for a lead-fixing tape, by using a copolymer produced by reacting a tetracarboxylic dianhydride, a diamine or a diisocyanate, and a polyester. SOLUTION: A copolymer obtd. by reacting a tetracarboxylic dianhydride, a diamine or a diisocyanate, and a polyester is used. The copolymer is obtd. by reacting a tetracarboxylic dianhydride, a diamine or a diisocyanate, 30-70wt.% (based on the total wt.) polyester, and other necessary ingredients including a catalyst in an org. solvent under such conditions as to produce a polyesterimide copolymer. The resultant product can be used as it is; however, the use of a copolymer obtd. by mixing the product with a poor solvent (e.g. an alcohol or water) to form a precipitate and drying it is pref. A varnish prepd. by adding an org. solvent to the product is used as an adhesive member for adherends such as semiconductor elements and lead frames.
Inventors:
Shuichi Matsuura
Krishna Machary Sudarsanam
Krishna Machary Sudarsanam
Application Number:
JP2457697A
Publication Date:
October 10, 2007
Filing Date:
February 07, 1997
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08L79/08; C09J7/02; C09J179/08; H01L21/52; H01L21/60
Domestic Patent References:
| JP56036561A | ||||
| JP7252459A | ||||
| JP7228697A | ||||
| JP6093238A | ||||
| JP8231721A | ||||
| JP52029825A |