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Title:
RESIN FILLED TYPE ELECTRONIC CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JPH06176809
Kind Code:
A
Abstract:

PURPOSE: To provide a resin filled type electronic circuit device in which a connector and a case are mutually fastened firmly, the rigidity of the case is increased, and further the easiness of resin filling workability is equal to or more than that of a conventional one.

CONSTITUTION: A resin filled type electronic circuit device is composed of an electronic parts-mounted circuit board 2, a connector 3 provided on the circuit board 2, a top face open case 1 containing the circuit board 2, and resin 6 filled and cured in the case 1. The fitting portion 10 of the connector 3 formed in the side wall of the case 1 is formed into cylindrical. The periphery of the connector 3 is held by the case 1 in a state that the connector 3 is fitted into the cylindrical fitting portion 10 from the side thereof.


Inventors:
OKUDA KOJI
Application Number:
JP32415192A
Publication Date:
June 24, 1994
Filing Date:
December 03, 1992
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01R9/16; H01R13/74; H05K5/00; H05K7/14; (IPC1-7): H01R9/16; H01R13/74; H05K5/00; H05K7/14
Attorney, Agent or Firm:
Takada Mamoru



 
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