Title:
RESIN MOLD CAPACITOR
Document Type and Number:
Japanese Patent JP3536130
Kind Code:
B2
Abstract:
PURPOSE: To provide a resin mold capacitor wherein generation of peeling is restrained and reliability is improved by reducing a stress which works when a capacitor element contracts between a dielectric and a lead extraction electrode, and a lead extraction electrode and an extracted lead constituting a capacitor element.
CONSTITUTION: A capacitor element 2 wherein a lead extraction electrode 1 is formed in a side surface is contained inside a case 3, and an extracted lead 4 having a bendable part 4a which is easier to be deformed than other part is attached to the lead extraction electrode 1. A pressure member 5 which presses the extracted lead 4 to the lead extraction electrode 1 is provided between a side surface of the case 3 and the extracted lead 4. Urethane resin 6 is put below the bendable part 4a of the extracted lead 4 inside the case 3.
More Like This:
| JP2006332450 | ELECTRONIC COMPONENT |
Inventors:
Takahashi, Yuuki
Sasaki, Kazuhiko
Suzuki, Yasushi
Sasaki, Kazuhiko
Suzuki, Yasushi
Application Number:
JP3904894A
Publication Date:
June 07, 2004
Filing Date:
January 28, 1994
Export Citation:
Assignee:
SHIZUKI DENKI SEISAKUSHO:KK
International Classes:
H01G4/228; H01G4/18; (IPC1-7): H01G4/228
Attorney, Agent or Firm:
西森 正博