Title:
RESIN MOLDING MATERIAL, MOLDING, COIL AND MOLDING MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2023018448
Kind Code:
A
Abstract:
To provide a resin molding material which enables formation of a molding that is excellent in filling property to a mold and in moldability and mechanical strength such as flexural strength in heating.SOLUTION: A resin molding material contains (A) soft magnetic particles, (B) an epoxy resin, (C) a phenol curing agent, and (D) an imidazole-based curing accelerator, wherein at least one of the epoxy resin (B) and the phenol curing agent (C) has a biphenyl aralkyl skeleton, and an equivalent ratio (b/c) of an epoxy equivalent b of the epoxy resin (B) to a phenolic hydroxyl group equivalent c of the phenolic curing agent (C) is 1.4 or more and 6.5 or less.SELECTED DRAWING: None
Inventors:
KITADA TETSUYA
Application Number:
JP2021122589A
Publication Date:
February 08, 2023
Filing Date:
July 27, 2021
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
H01F1/26; C08G59/40; C08K3/01; C08K5/3445; C08L63/00; H01F27/255; H01F41/02
Attorney, Agent or Firm:
Shinji Hayami