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Title:
RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JP2009197057
Kind Code:
A
Abstract:

To provide a resin molding material that solves such a problem as further improvement of rigidity and flowability that in some cases may be required of a resin composition prepared by blending an organized phyllosilicate into a linear thermoplastic polymer such as a polycarbonate as is the case with a thin-walled molded article as a typical representative.

The resin molding material comprises 25-99.4 wt.% linear thermoplastic polymer (component A) composed mainly of at least one kind selected from the group consisting of a polycarbonate, a polyarylate, a polyalkylene naphthalate and a polyphenylene ether, 0.1-30 wt.% phyllosilicate (component B) having a cation exchange capacity of 50-200 milliequivalent/100 g and 0.5-45 wt.% macrocyclic oligomer(component C) as an additive to the polymer in the case when the total of component A-component C is 100 wt.%.


Inventors:
IMAMURA KOICHI
YAMANAKA KATSUHIRO
KASHIMA KEIICHI
Application Number:
JP2008037469A
Publication Date:
September 03, 2009
Filing Date:
February 19, 2008
Export Citation:
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Assignee:
TEIJIN CHEMICALS LTD
International Classes:
C08L69/00; C08J3/22; C08K9/04; C08L67/00; C08L71/12
Attorney, Agent or Firm:
Hideko Mihara