Title:
RESIN MOLDING, METAL-COATED RESIN MOLDING, CIRCUIT BOARD, ILLUMINATION REFLECTING PLATE AND METHOD FOR MANUFACTURING RESIN MOLDING
Document Type and Number:
Japanese Patent JP3873660
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin molding capable of obtaining a high adhesive property strength of a metal film via fine recesses.
SOLUTION: Many fine recesses 1 are formed on a surface of the resin molding, and parts of contained fillers 2 are protruded into the recesses 1. When a metal film 4 is coated on the surface of the resin molding 3, the parts of the metal of the film 4 are intruded into the recesses 1 to enable an anchoring effect to be obtained. Further, the fillers protruded into the recesses 1 are intruded into the metal to increase the anchoring effect.
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Inventors:
Masahiro Sato
Naoto Ikegawa
Naoto Ikegawa
Application Number:
JP2001157632A
Publication Date:
January 24, 2007
Filing Date:
May 25, 2001
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
B29C45/00; G02B5/10; B29C45/46; B29C45/73; B29C45/77; B29C45/78; B32B15/08; C08J5/00; C08J7/06; B29K105/16; (IPC1-7): B29C45/46; B29C45/77; B29C45/78; B32B15/08; C08J5/00; C08J7/06; G02B5/10; //B29K105:16; C08L101:00
Domestic Patent References:
| JP59099733U | ||||
| JP7290902A | ||||
| JP9052252A | ||||
| JP9148733A |
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori
Atsuo Mori