Title:
RESIN MOLDING METHOD AND RESIN MOLDING DEVICE
Document Type and Number:
Japanese Patent JP3590118
Kind Code:
B2
Abstract:
PURPOSE: To make possible the creation of a resin molding with enhanced molding properties and consequently increased reliability by injecting a resin supplied from a pot under pressure into an interior between a molding and a release film and mold the resin along the inner profile of a resin molding part.
CONSTITUTION: A release film 20 is supported by aspiration onto the facing of molding dies 10a, 10b with a resin molding part, and a molding 30 is clamped through the release film 20. In addition, a resin supplied under pressure from a pot 12 is injected into an interior between the molding 30 and the release film 20 covering the former. The resin is charged into the interior in such a manner that it inflates the release film 20, and thus is formed along the inner profile of the resin molding part. Further, the resin is charged into a clearance between the release film 20 and the molding 30, so that the charging of the resin is accomplished without the entrainment of an air to form the resin molding free from air voids.
Inventors:
Fumio Miyajima
Application Number:
JP896295A
Publication Date:
November 17, 2004
Filing Date:
January 24, 1995
Export Citation:
Assignee:
Apic Yamada Corporation
International Classes:
B29C33/18; B29C33/68; B29C45/02; B29C45/14; B29C45/34; H01L21/56; H01L23/28; (IPC1-7): B29C45/02; B29C33/68; B29C45/34; H01L21/56; H01L23/28
Domestic Patent References:
| JP2196610A | ||||
| JP47004230A | ||||
| JP2191111A | ||||
| JP3114808A | ||||
| JP7283260A | ||||
| JP8156029A | ||||
| JP8186141A | ||||
| JP8017855A |
Attorney, Agent or Firm:
Takao Watanuki
Horimai Kazuharu
Horimai Kazuharu
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