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Title:
RESIN MOLDING MOLD, RESIN MOLDING MANUFACTURING METHOD, AND RESIN PALLET
Document Type and Number:
Japanese Patent JP2012116073
Kind Code:
A
Abstract:

To provide a resin pallet in which a stress concentration and molding distortion are hardly generated, a resin molding mold which can mold the resin pallet and the other resin molding, and a resin molding manufacturing method.

In the resin molding mold 50, when the mold is closed, the inclined molding surface 53 of a fixed mold 51 and the inclined molding surface 63 of a movable mold 61 are opposed to each other with a molding space held between them, a first inclined protrusion 54 protruded from the inclined molding surface 53 and a second inclined protrusion 64 protruded from the inclined molding surface 63 are combined to form a square plate 69, and the plate 69 is held between the inclined molding surface 53 and the inclined molding surface 63 in the thickness direction. When a resin is packed in the molding space, front and rear flat surfaces of an inclined flat plate wall 33 are formed of the inclined molding surface 53 and the inclined molding surface 63, and the wall body by an amount of a plate-shaped body 69 is removed from the inclined flat plate wall 33 to mold a square through-hole 34.


Inventors:
KAWAMOTO KOSUKE
Application Number:
JP2010267319A
Publication Date:
June 21, 2012
Filing Date:
November 30, 2010
Export Citation:
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Assignee:
SANKO CO LTD
International Classes:
B29C33/42; B29C45/37
Domestic Patent References:
JPH07149395A1995-06-13
JP2008174292A2008-07-31
JPH027791Y21990-02-23
Attorney, Agent or Firm:
Hiroshi Matsuura