Title:
RESIN MOLDING OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS6024025
Kind Code:
A
Abstract:
PURPOSE:To isolate leads from a heat sink plate securely by a simple structure even if the leads touch the head sink plate owing to the connection work of fine metal wires by providing a plurality of gates to a resin molding apparatus. CONSTITUTION:A semiconductor element 7 is fixed to the top surfaces of a heat sink plate 2 of a lead frame and the electrodes of the element are connected to lead strips 61-67 by metal fine wires 8. The connection structure is set in a resin molding apparatus 9 which includes a top die 9a and a bottom die 9b in such a manner that the plate 2 is placed in a cavity part and long lead strips 61-67 extended over the plate 2 are facing gates 10, 10 provided to the die 9b. A resin material is poured from a runner 11 into the cavity part through the gates 10, 10 to complete the assembly. With this constitution, even if the lead strips 61, 67 touch or more close to the plate 2 as shown by dot-lines, they are floated by the flow of the resin material poured from the gates 10, 10 so that the lead strips 61, 67 is isolated forcibly from the plate 2.
Inventors:
YAMAGUCHI HIROYUKI
Application Number:
JP13257883A
Publication Date:
February 06, 1985
Filing Date:
July 19, 1983
Export Citation:
Assignee:
KANSAI NIPPON ELECTRIC
International Classes:
H01L21/56; (IPC1-7): H01L21/56