Title:
RESIN PACKAGE METHOD OF ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JPS5471573
Kind Code:
A
Abstract:
PURPOSE:To perform resin sealing with powder coating of a low glass transition temperature as a lower layer and powder coating of a high glass transition temperature as an upper layer. CONSTITUTION:Thermosetting polyurethane, polyester, epoxy powder, etc. are used and those of glass transition temperatures O up to 200 deg.C are used. Inorganic fillers can be contained. The resin having heat-set at the glass transition temperature hardens like glass from rubber form. As the temperature is lower than the glass transition temperature, stresses increase with electronic parts, thus causing cracking and characteristic defects. Thereupon, a coating film of a low glass transition temperature is provided near the electronic parts to reduce the stresses and a coating film of a high glass transition tempeture is externally provided to protect against the de formation and breakdown caused by the impact from the outside and provide good water-resistant performance. These are then tightened by the stresses being generated, whereby the adhesion of lead wires, etc. is improved.
Inventors:
TAMAOKI AKINOBU
TAKASAGO HAYATO
TAKASAGO HAYATO
Application Number:
JP13854777A
Publication Date:
June 08, 1979
Filing Date:
November 17, 1977
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K5/00; H01L21/56; H05K5/06; (IPC1-7): H01L21/56; H01L23/30; H05K5/06