To avoid cut-off of a wire which conducts a semiconductor chip and an internal lead electrically, due to heat upon mounting a semiconductor device on a printed board.

The resin package type semiconductor device 1 is equipped with the semiconductor chip 10; a wire 12 whose one end is pressure-bonded to a semiconductor chip 10; a plurality of internal leads 13 electrically conducting to the semiconductor chip 10 through the other end of the wire 12, which is bonded thereto by pressure, and a resin package 14 which wraps the semiconductor chip 10 and respective internal leads 13. In the semiconductor device 1, an angle β of the extension of the wire 12, extending from a base end of the pressure bonding part 12b with the internal lead 13, is specified as being not larger than 15° with respect to the internal lead 13 from the base end of the pressure bonding part 12b to a length of at least two times of the diameter of the wire 12.