Title:
RESIN PACKAGING METHOD FOR ELECTRONIC PART
Document Type and Number:
Japanese Patent JP3013650
Kind Code:
B2
Abstract:
PURPOSE: To coat an electronic part with exterior resin sufficiently, and prevent a deterioration in strength and airtightness of the resin, by making a reference line on a terminal of the electronic part as a maximum lower bound of coating with the resin, and coating a terminal from the reference line to an element side with a repellent material that repels a lubricant.
CONSTITUTION: Each reference line 6 is provided on terminals 3, 4 and 5 as a maximum lower bound of exterior coating with resin 9. A repellent material 7, such as polyesteramide, against a lubricant 8 is applied to terminals 3, 4 and 5 partly from the reference line 6 near to an electronic-part element 2. Then, the repellent material 7 applied from the reference line 6 near to the electronic-part element 2 repels the lubricant 8 even when the lubricant is applied by mistake or runs over the reference line 6 near to the electronic-part element 2. In this way, the lubricant 8 is prevented from adhering over the reference line 6 near to the electronic-part element 2, and a deterioration in strength and airtightness of the exterior resin can be prevented.
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Inventors:
Satoshi Miura
Application Number:
JP10909093A
Publication Date:
February 28, 2000
Filing Date:
May 11, 1993
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G4/228; H01G13/00; H01L21/56; H03H3/02; H01C17/02; H04R17/00; (IPC1-7): H01G13/00
Domestic Patent References:
| JP5752104A |