Title:
RESIN PAVEMENT MATERIAL, RESIN PAVEMENT METHOD, SURFACE TREATMENT METHOD FOR ASPHALT PAVEMENT, AND CIVIL ENGINEERING AND CONSTRUCTION MATERIAL
Document Type and Number:
Japanese Patent JP3882161
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To significantly reduce splash and fall of aggregate, improve the durability of a paved surface and expand greatly uses and applications of rubber chips and other aggregate by increasing adhesion by adherence of a surface material to the surrounding of the aggregate (core).
SOLUTION: A resin pavement material featuring the mixture of aggregate in which a surface material is fastened to the surface of a core through an adhesive and a binder as a resin.
Inventors:
Kamaishi Tadami
Hideharu Nagata
Kiyoshi Ken Ishii
Hideharu Nagata
Kiyoshi Ken Ishii
Application Number:
JP2000055415A
Publication Date:
February 14, 2007
Filing Date:
March 01, 2000
Export Citation:
Assignee:
Osada Giken Co., Ltd.
International Classes:
E01C7/30; C04B18/20; C04B20/10; C04B26/02; C08K3/00; C08K3/26; C08K3/34; C08K9/00; C08L21/00; C08L101/00; E01C5/20; E01C7/35; (IPC1-7): E01C7/30; C08L21/00; C08L101/00; E01C5/20; E01C7/35
Domestic Patent References:
JP6093135A | ||||
JP3137305A | ||||
JP11293614A | ||||
JP10265250A |
Foreign References:
DE4402432A1 |
Attorney, Agent or Firm:
Hisayoshi Nagata
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