PURPOSE: To use a common lead frame even when the size of semiconductor elements differs by mixing electrode pads on the semiconductor element onto inner leads in a resin sealing section through insulating adhesives so as to be formed in the upper projection region of fixing sections for the inner leads and shaping positioning patterns onto the inner leads.

CONSTITUTION: A frame-shaped lead support piece, size of which is slightly larger than a semiconductor element 11 and which corresponds to the peripheral section of the semiconductor element 11, is fastened on the side reverse to an adhesive surface in the semiconductor element 11 as a positioning pattern 19 at the noses of inner leads 16A. Since the semiconductor element 11 is arranged so that electrode pads 15 for the semiconductor element 11 are positioned in a projection region in the upper section of a semiconductor-element fixing section in the inner leads 16A, the semiconductor element 11 is supported correctly by the inner leads 16A even when the semiconductor element 11 is shocked when the electrode pads 15 and the inner leads 16A are connected by gold wires 14 through wire bonding, thus generating no crack in the semiconductor element 11.