Title:
RESIN-SEALED SEMICONDUCTOR DEVICE, AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH042152
Kind Code:
A
Abstract:
PURPOSE: To provide a resin-sealed semiconductor device with a reliable sensor contained in a less expensive package by providing a recess in the mold resin to expose the sensor part to open air.
CONSTITUTION: A semiconductor device 1A has a sensor part 1a, the surface of which is coated with releasable resin 14 such as vinyl resin or acrylic resin. The semiconductor device is molded by transfer molding with sealing resin 13 that is supplied through a port 17 of a molding die 16 having a projection 15 to be in contact with the resin 14. The resin 14 is removed by acetone to form a recess in which the sensor part 1a is exposed to open air.
Inventors:
MORI RYUICHIRO
Application Number:
JP10170190A
Publication Date:
January 07, 1992
Filing Date:
April 19, 1990
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G01N27/12; B29C45/14; H01L21/56; H01L23/28; (IPC1-7): H01L23/28; G01N27/12; H01L21/56
Domestic Patent References:
| JPS6132535A | 1986-02-15 |
Attorney, Agent or Firm:
Mitsuteru Soga (5 people outside)
Next Patent: JPH042153