Title:
RESIN-SEALED TYPE SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH05109970
Kind Code:
A
Abstract:
PURPOSE: To prevent sealing resin from peeling off a fixing pad due to moisture absorption in a resin-sealed type semiconductor by improving a flow of vapor pressure at the time of substrate packaging.
CONSTITUTION: A pad 2 for mounting a semiconductor element and a rim of its support are subjected to plastic working to form a space 10 under them, and this space is sealed with resin after it is closed by a film material 11 easy to pass through. Vapor due to moisture absorption of the resin enters the space through this film and is led outside the semiconductor device through the space under the supporter.
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Inventors:
ADACHI MITSURU
Application Number:
JP26482191A
Publication Date:
April 30, 1993
Filing Date:
October 14, 1991
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L23/28; H01L23/50; (IPC1-7): H01L23/28; H01L23/50
Attorney, Agent or Firm:
Toshiaki Suzuki