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Patent Searching and Data


Title:
RESIN SEALER
Document Type and Number:
Japanese Patent JPH09201843
Kind Code:
A
Abstract:

To accelerate time until resin in a cull-remaining part is cured by a method wherein a shape of the cull-remaining part is made non-cylindrical to increase a value of a ratio of surface area to volume, ad heat from a mold is made further easy to received.

A cull-remaining part 14 formed above a pot 3 housing a tablet 2 consisting of thermosetting resin in a mold 10 has a non-cylindrical shape, for example, a regular square pole shape, and a value of a ratio of surface area to volume is increased. A tablet 2 in the pot 3 is pushed up with a plunager 8, made to flow by melting by heat from the mold 10, sent by pressure into each cavity 5 through the cull-remaining part 14, a runner 6, and a gate 7, and the molten resin is cured to seal a semiconductor element being an object to be sealed. Since a value of the ratio of the surface area to the volume of the cull-remaining part 14 is large, the tablet 2 becomes further easy to receive heat from the mold 10, time until the resin in the cull-remaining part 14 is cured is accelerated, and productivity of the semiconductor element is improved.


Inventors:
MOGAMI KEIICHI
Application Number:
JP3563796A
Publication Date:
August 05, 1997
Filing Date:
January 29, 1996
Export Citation:
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Assignee:
SONY CORP
International Classes:
B29C45/26; B29C45/02; B29C45/14; H01L21/56; B29L31/34; (IPC1-7): B29C45/02; B29C45/14; B29C45/26; H01L21/56