樹脂封止装置 - Apic Yamada Co., Ltd.

Title:

樹脂封止装置

Document Type and Number:

Japanese Patent JP7445974

Kind Code:

B2

Abstract:

Provided is a resin sealing device in which dust is difficult to diffuse. A resin sealing device (1) has a tablet supply unit (4) capable of transporting a resin tablet to a standby position (A) of a loader (8) for transporting a work and a resin tablet used for resin encapsulation, and supplying the resin tablet to the loader (8); and a shutter (30) installed at an opening (20) communicating the transporting area of the loader (8) and the transporting area of the tablet supply unit (4) to be capable of opening and also closing the opening (20).

More Like This:

JPH065925	[Name of invention] Cutting device for filler-filled molten resin
JP2004262121	METHOD AND DEVICE FOR SUPPLYING RESIN RAW MATERIAL FOR SYNTHETIC RESIN MOLDING MACHINE
WO/2022/050942	AUTOMATICALLY-THREADING FIBER PLACEMENT HEAD

Inventors:

▲高▼山凌
Takayuki Yanagisawa
Tatsushi Oguchi
Youhei Sato

Application Number:

JP2020176193A

Publication Date:

March 08, 2024

Filing Date:

October 20, 2020

Export Citation:

Click for automatic bibliography generation Help

Assignee:

Apic Yamada Co., Ltd.

International Classes:

B29C31/04; B29C45/02; B29C45/17; B29C45/18; H01L21/56

Domestic Patent References:

JP2003179084A
JP2009147188A
JP2005271464A
JP11188759A
JP9314612A
JP2020107700A
JP4120743A

Foreign References:

KR100615904B1

Attorney, Agent or Firm:

Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Koichi Sawai

Previous Patent: lid

Next Patent: Microphone array device, sound field control system, sound field recording system, and sound field r...