Title:
RESIN SEALING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2004127962
Kind Code:
A
Abstract:
To enhance the reliability of a semiconductor device where the back side of a semiconductor chip mounting part is exposed by preventing resin from leaking to the exposed surface.
An annular recess 14 is made in the exposed surface of the pad 2 of a lead frame in proximity to sealing resin and a protrusion 15 having a shape corresponding to that of the recess 14 is formed on the vent hole pin 13 of a resin sealing device 8. Resin sealing is performed while fitting the protrusion 15 in the recess 14.
Inventors:
SHIBA KENICHIRO
Application Number:
JP2002285449A
Publication Date:
April 22, 2004
Filing Date:
September 30, 2002
Export Citation:
Assignee:
MITSUI HIGH TEC
International Classes:
B29C33/12; H01L21/56; H01L23/28; H01L23/50; B29L31/34; (IPC1-7): H01L21/56; B29C33/12; H01L23/28
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