RESIST MATERIAL AND PATTERN FORMING PROCESS

Title:

RESIST MATERIAL AND PATTERN FORMING PROCESS

Document Type and Number:

Japanese Patent JP2023178954

Kind Code:

A

Abstract:

To provide a resist material that offers high sensitivity and improved LWR and CDU independent of whether it is of positive or negative tone, and a pattern forming process using the same.SOLUTION: A resist material comprises a quencher comprising a sulfonium salt of carboxylic acid having a coumarin or thiocoumarin structure.SELECTED DRAWING: None

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WO/2005/053368	METAL PATTERN FORMING METHOD, METAL PATTERN OBTAINED BY THE SAME, PRINTED WIRING BOARD, CONDUCTIVE FILM FORMING METHOD, AND CONDUCTIVE FILM OBTAINED BY THE SAME
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JP2000275826	PASTE COMPOSITION AND CIRCUIT BOARD USING SAME

Inventors:

HATAKEYAMA JUN
WATANABE ASAMI

Application Number:

JP2023085306A

Publication Date:

December 18, 2023

Filing Date:

May 24, 2023

Export Citation:

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Assignee:

SHINETSU CHEMICAL CO

International Classes:

G03F7/004; G03F7/038; G03F7/039; G03F7/20

Attorney, Agent or Firm:

Patent Attorney Corporation Eimei International Patent Office

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