Title:
リテーナリング、これを用いた研磨装置、及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6643918
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a retainer ring that enables uniform distribution of a polishing material on a wafer surface.SOLUTION: A retainer ring 11 used for polishing processing of a semiconductor wafer has: a groove 111 formed on a contact surface 115 with a polishing pad, and configured to take a slurry in a ring and exhaust it to an opposite side; and slurry diffusion means 15 provided on a ring outer wall 112. Even in a case where the contact surface is worn as the polishing processing progresses, a flow is facilitated by the diffusion means to prevent a slip, and thereby, the slurry can be uniformly distributed on a wafer surface.SELECTED DRAWING: Figure 5
Inventors:
Fumihiko Akahoshi
Toyofuku Takeshi
Toyofuku Takeshi
Application Number:
JP2016032031A
Publication Date:
February 12, 2020
Filing Date:
February 23, 2016
Export Citation:
Assignee:
Mie Fujitsu Semiconductor Limited
International Classes:
H01L21/304
Domestic Patent References:
| JP2009034745A | ||||
| JP2009224680A |
Foreign References:
| US20130035022 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Takao Kato
Tadahiko Ito
Takao Kato