To provide a rubber chip molding and solidifying method capable of uniformly curing rubber chips even if high pressure and high temperature steam is supplied and suppressing the surface whitening phenomenon of a molded product.

A humidity-curable thermosetting resin adhesive is used as an adhesive, and this thermosetting resin adhesive and rubber chips cut into a predetermined size are compounded and kneaded in a predetermined ratio to obtain raw material kneaded matter 11 comprising the rubber chips and the thermosetting resin adhesive. After this kneaded matter 11 is charged in the cavity 3 formed into a product shape between molds 1 and 2 to be pressurized and molded, these molds 1 and 2 are held to a temperature capable of curing the thermosetting resin adhesive for a predetermined time and steam is supplied to the surfaces of both of the mold 1 on a cavity side and the mold 2 on a core side at the same time and subsequently supplied not only to the mold 2 on the core side from the mold 1 on the cavity side but also to the mold 1 on the cavity side from the mold 2 on the core side alternately so as to leave a time lag to heat the thermosetting resin adhesive by steam to cure the same by humidity and the raw material kneaded matter 11 is uniformly bonded and cured.