To provide a sample preparation device capable of taking out only a sample piece containing a desired specified area from a semiconductor wafer or a device chip, to be conveyed and fixed, in particular, suitable for automation by facilitating the positioning of a probe tip in micro-manipulation.

This device uses ion beam machining, a conveying technique for the sample piece and a fixing technique for the sample piece on a sample piece holder. In particular, an electric current flowing into the conveying probe is made into a data while synchronized with ion beam scanning to identify easily a position of the probe tip.