SEAL MATERIAL FOR SEMICONDUCTOR FABRICATION APPARATUS

Title:

SEAL MATERIAL FOR SEMICONDUCTOR FABRICATION APPARATUS

Document Type and Number:

Japanese Patent JP2006228805

Kind Code:

A

Abstract:

To provide a seal material for a semiconductor fabrication apparatus of fluororubber system which can be suitably used as the seal material for the semiconductor fabrication apparatus which is excellent in plasma resistance, compression set, etc.

The seal material for the semiconductor fabrication apparatus contains 80-50 wt.% of perfluoro elastomer (FFKM) of polyethylene tetrafluoride-perfluoro alkyl vinyl ether system as a rubber component (FKM), and 20-50 wt.% (FFKM+FKM=100 wt.%) of fluororubber (FKM) other than FFKM. Therefore, it is excellent in plasma crack resistance, and even when it is used as a seal material for a portion undergoing the irradiation of a plasma generated within the semiconductor fabrication apparatus directly or indirectly, the weight percentage reduction of the seal material is small, and yet a crack cannot go into the seal material easily. Moreover, the compression set is also small, and further these properties balancing is still better, and it can be suitably operated as the seal material for the semiconductor fabrication apparatus.

Inventors:

OKAZAKI MASANORI

Application Number:

JP2005037746A

Publication Date:

August 31, 2006

Filing Date:

February 15, 2005

Export Citation:

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Assignee:

NIHON VALQUA KOGYO KK

International Classes:

H01L21/3065; C08L27/12; C09K3/10; F16J15/10; H01L21/205

Domestic Patent References:

JP2004134665A	2004-04-30
JP2001348462A	2001-12-18
JP2004277496A	2004-10-07
JP2003231719A	2003-08-19

Foreign References:

WO2004038781A1	2004-05-06
WO2004094527A1	2004-11-04

Attorney, Agent or Firm:

Shunichiro Suzuki
Koji Makimura
Chihata Takahata
Toru Suzuki

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