Title:
シール構造、基板処理装置及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP7418603
Kind Code:
B2
Abstract:
According to one aspect of the technique of the present disclosure, there is provided a seal structure capable of sealing a space between a first structure heated by a heater and a second structure arranged so as to face the first structure, the seal structure including: a metal plate arranged in contact with the first structure; and a sealing material made of a resin material and arranged in contact with the metal plate and the second structure, wherein the space between the first structure and the second structure is sealed by the metal plate and the sealing material.
Inventors:
Takayuki Sato
Tetsuaki Inada
Kenta Sasaki
Tetsuaki Inada
Kenta Sasaki
Application Number:
JP2022551881A
Publication Date:
January 19, 2024
Filing Date:
September 10, 2021
Export Citation:
Assignee:
KOKUSAI ELECTRIC Inc.
International Classes:
H01L21/31; C23C16/44; H05H1/46
Domestic Patent References:
| JP2005183645A | ||||
| JP2008177524A | ||||
| JP4079421U | ||||
| JP2003124206A | ||||
| JP5149433A |
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office