Title:
SEALING EPOXY RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPH0616908
Kind Code:
A
Abstract:
PURPOSE: To obtain a sealing epoxy resin molding material excellent in adhesiveness to lead wires and metallic mold releasability.
CONSTITUTION: The sealing epoxy resin molding material is characterized by including a reactional product of polyethylene oxide with a modified silicone oil therein.
Inventors:
HARA RYUZO
OKABE HIDEKI
SAKAMOTO TAKASHI
OKABE HIDEKI
SAKAMOTO TAKASHI
Application Number:
JP17533092A
Publication Date:
January 25, 1994
Filing Date:
July 02, 1992
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08L63/00; C08G59/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Mikio Kawase (1 person outside)
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