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Patent Searching and Data


Title:
SEALING MATERIAL COMPOSITION
Document Type and Number:
Japanese Patent JPH05287261
Kind Code:
A
Abstract:

PURPOSE: To obtain a sealing composition improved in the durability of bonding by using a specified polyoxyalkylene polymer containing reactive silicon groups.

CONSTITUTION: An oxyalkylene polymer terminated with a functional group such as hydroxyl, epoxy or isocyanate is reacted with a compound containing a functional group reactive with the above functional group and a reactive silicon group to obtain a polyoxyalkylene polymer containing reactive silicon groups of the formula [wherein R1 and R2 are each 1-20C alkyl, 6-20C aryl, 7-20C aralkyl or triorganosiloxy of (R3)3-SiO; R3 is a 1-20C monovalent hydrocarbon group; X is a hydroxyl group or a hydrolyzable group; (a) is 0-3; (b) is 0-2; (m) is 0-19; and a+Σb≥1]. This polymer is mixed with a tin (IV) compound to obtain the objective composition which can give a cured product with a thermal compression recovery of 10% or below.


Inventors:
IWAKIRI HIROSHI
FUJITA MASAYUKI
HASEGAWA TAKASHI
Application Number:
JP11679892A
Publication Date:
November 02, 1993
Filing Date:
April 10, 1992
Export Citation:
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Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
C08L71/02; C09K3/10; E04B1/682; (IPC1-7): C09K3/10; C08L71/02; E04B1/682
Attorney, Agent or Firm:
Tadashi Hagino (3 outside)