PURPOSE: To aim at the simplification of sealing process and injecting process of an insulating material by using a photosetting resin as insulating material and using a back substrate having openings more than 2.
CONSTITUTION: A back substrate 8 having 2 openings of an injection hole 9 and an evacuation hole 10 is bonded to a film EL panel formed by conventional method. A liquid photosetting resin is injected from the hole 9 and is simultaneously evacuated from the hole 10. Next, the ultraviolet rays are irradiated for 3 minutes so as to harden the resin. After chipping the resin adhered in circumference of the hole 9 and the hole 10 and cleaning by organic solvent, a sealing plate 12 made of a piece of glass is bonded with the resin 11 so as to seal the openings. Sealing of the panel can be thus simplified by using the photosetting resin as insulating material and providing holes more than 2 on the back substrate.
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MAN TOSHIHIRO
KONDO AKIO
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