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Patent Searching and Data


Title:
SEALING METHOD OF RESIN AND METALLIC MOLD THEREFOR
Document Type and Number:
Japanese Patent JPS587322
Kind Code:
A
Abstract:

PURPOSE: To prevent molten resin without fail from being stuck to the whole surface of the exposed side in the radiating plate of a lead frame by setting the surface part of the exposed side to the cavity so that it may be supported under a specific state.

CONSTITUTION: The circumferential edge of the surface part 7a in the radiating plate 7 of a lead frame 6 and the circumferential edge 9a of a cavity part 9 are welded under pressure when the dies are closed and the surface part 7a is held by the upper side of the holding body 8 to be held on the same level as the cavity bottom. The molten resin A can be prevented from entering the cavity part 9, the lead frame side does not bend or deform to the side of the cavity part 9 and the permeated molten resin A can be prevented from being stuck all over the side of the surface part 7a.


Inventors:
BANDOU KAZUO
Application Number:
JP10524681A
Publication Date:
January 17, 1983
Filing Date:
July 06, 1981
Export Citation:
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Assignee:
BANDOU KAZUO
International Classes:
B29C45/00; B29B7/00; B29C33/00; B29C35/00; B29C39/00; B29C39/10; B29C39/26; B29C45/02; B29C45/14; H01L21/56; (IPC1-7): B29C6/00; B29D3/00
Domestic Patent References:
JPS5791246U1982-06-04
Attorney, Agent or Firm:
Iwanaga