Title:
SEALING PROCESS OF ELECTRONIC PART
Document Type and Number:
Japanese Patent JPS61113242
Kind Code:
A
Abstract:
PURPOSE:To provide the title sealing process with excellent properties such as airtightness, shorter molding time and less burrs by a method wherein a sealed part is coated with silane base coupling agent while polyphenylenesulfide polymer is utilized as a sealing material. CONSTITUTION:Outer surface of sealed part is coated with silane base coupling agent. In either case of transfer molding or extrusion molding, a sealed part is contained in a plasticizing chamber provided on a metallic mold made of polyphenylenesulfide polymer i.e. PPS as a sealing material to plasticize the sealed part by means of heating it up to softening temperature and then the sealed part is pressure-fixed in said metallic mold to be hardened for sealed molding. PPS is provided with excellent properties such as excellent thermal resistance, less burrs occuring, shorter molding time and regeneration of partial sprue runner, etc. Through these procedures, the silane base coupling agent may be provided with sufficient adhesion to the sealed part and airtightness.
Inventors:
SHIMANUKI MAKOTO
Application Number:
JP23642384A
Publication Date:
May 31, 1986
Filing Date:
November 07, 1984
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K3/28; H01F27/02; H01F27/06; H01L21/56; (IPC1-7): H05K3/28
Attorney, Agent or Firm:
Masuo Oiwa