Title:
SEALING RESIN COMPOSITION AND SEALED SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0496922
Kind Code:
A
Abstract:
PURPOSE:To obtain the subject composition, composed of a specific epoxy resin, a novolak type phenolic resin, a dialkylamino-diazabicyclo-undecene curing accelerator and silica powder and excellent in moldability, moisture and solder heat resistance of thin-walled parts. CONSTITUTION:The objective composition is composed of (A) an epoxy resin expressed by formula I, (B) a novolak type phenolic resin, (C) a dialkylamino-1,8- diazabicyclo [5.0.4] undecene curing accelerator expressed by formula II (R<1> and R<2> are CnH2n+1; (n) is 0 or an integer of >=1) and (D) silica powder (preferably having <=30/mum average particle diameter). The component (C) is contained in an amount of 0.01-5wt.% based on the composition. The aforementioned composition is preferably and normally prepared as a molding material by homogeneously mixing the aforementioned respective components in a mixer, etc., then carrying out melt mixing treatment with hot rolls, subsequently cooling and solidifying the molten mixture and then pulverizing the resultant solidified mixture.
Inventors:
NAGATA TSUTOMU
SAWAI KAZUHIRO
KOKUBO MASANORI
AMAYA YUICHI
SAWAI KAZUHIRO
KOKUBO MASANORI
AMAYA YUICHI
Application Number:
JP21475790A
Publication Date:
March 30, 1992
Filing Date:
August 14, 1990
Export Citation:
Assignee:
TOSHIBA CHEM CORP
International Classes:
C08G59/62; C08G59/00; C08G59/20; C08G59/22; C08G59/40; C08G59/50; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/22; C08G59/50; C08G59/62; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Eiji Morota
Next Patent: JPS496923