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Title:
SEALING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS6222823
Kind Code:
A
Abstract:

PURPOSE: The titled composition low in stress and excellent in moisture resistance and laser markability, prepared by mixing an epoxy resin with a novolak phenolic resin, a specified organic dye, crystalline thermoplastic resin nylon-12 and an inorganic filler.

CONSTITUTION: A mixture formed by mixing an epoxy resin (A) having at least two epoxy groups in the molecule with a novolak phenol(-modified) resin (B) obtained from a phenol and (para)formaldehyde at a molar ratio of the epoxy groups of component A to the phenolic hydroxyl groups of component B of 0.1W10 is mixed with 0.01W10wt% organic dye (C) having at least one metal atom or ion in the molecule (e.g., a compound of formula I), 0.1W21wt% crystalline thermoplastic resin nylon-12 (D) having a group of formula II (wherein n≥1), 25W90wt% inorganic filler (E) (e.g., silica powder) and, optionally, a mold release, a flame retardant, a colorant, a silane coupling agent, etc.


Inventors:
HOSOKAWA HIROYUKI
SAWAI KAZUHIRO
Application Number:
JP16128485A
Publication Date:
January 31, 1987
Filing Date:
July 23, 1985
Export Citation:
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Assignee:
TOSHIBA CHEM CORP
International Classes:
C08G59/00; C08G59/44; C08G59/62; C08L63/00; C08L77/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/44; C08G59/62; C08L63/00; H01L23/30
Domestic Patent References:
JPS6047065A1985-03-14
JPS56152832A1981-11-26
JPS594619A1984-01-11
JPS5571771A1980-05-30
Attorney, Agent or Firm:
Eiji Morota