Title:
シーズニングプレート、半導体研磨装置、研磨パッドのシーズニング方法
Document Type and Number:
Japanese Patent JP5396616
Kind Code:
B2
Abstract:
A seasoning plate is placed on a polishing pad and performs seasoning of the polishing pad by abrading the polishing pad through the friction caused by rotation of the polishing pad. The seasoning plate includes: conditioners that abrade the polishing pad; a round flexible substrate that has the conditioners attached to the lower face thereof; an O-ring that is placed on the upper face of the flexible substrate, the O-ring forming a circle concentric with the flexible substrate; and a weight plate serving as a weight portion that is placed on the O-ring and applies weight for deforming the flexible substrate.
Inventors:
Daisuke Maruoka
Moroiwa
Moroiwa
Application Number:
JP2008278683A
Publication Date:
January 22, 2014
Filing Date:
October 29, 2008
Export Citation:
Assignee:
sumco tech xiv Co., Ltd.
International Classes:
H01L21/304; B24B37/00; B24B53/017; B24B53/12
Domestic Patent References:
| JP2005005388A | ||||
| JP6015563A | ||||
| JP2000024915A | ||||
| JP2000326205A |
Attorney, Agent or Firm:
Yuichi Murakami
Takahiro Deguchi
Takahiro Deguchi