Title:
ホットメルト接着剤または他のポリマー溶融物を塗布するためのセグメントダイ
Document Type and Number:
Japanese Patent JP4611521
Kind Code:
B2
Abstract:
A segmented die assembly comprises a plurality of side-by-side and separate units. Each die unit, includes a manifold segment and a die module mounted thereon. The manifold segments are interconnected and function to deliver process air and polymer melt to the modules. Each module including a nozzle through which the polymer melt is extruded forming a row of filament(s). The filaments from the array of modules are deposited on a substrate or collector. The die assembly is preferably used to apply a hot melt adhesive to a substrate, but also may be used to produce meltblown webs.
Inventors:
Allen, Martin, A.
Application Number:
JP2000535462A
Publication Date:
January 12, 2011
Filing Date:
March 12, 1999
Export Citation:
Assignee:
NORDSON CORPORATION
International Classes:
B05B7/10; B05B7/08; B05C5/04; B05C5/00; B05C5/02; B29C48/30; D01D4/02; D01D5/08; D01D5/098; D04H3/16
Domestic Patent References:
| JP9136053A |
Foreign References:
| US5605720 | ||||
| US5145689 | ||||
| US4051861 |
Attorney, Agent or Firm:
Okabe
Masao Okabe
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa
Masao Okabe
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa