Title:
半導体増幅回路
Document Type and Number:
Japanese Patent JP4086371
Kind Code:
B2
Inventors:
山▲崎▼ 博
Application Number:
JP23154898A
Publication Date:
May 14, 2008
Filing Date:
August 18, 1998
Export Citation:
Assignee:
富士通株式会社
International Classes:
G06G7/163; H03F3/45; H03F3/195; H03G3/10; H03H11/04
Domestic Patent References:
| JP9116350A | ||||
| JP2081505A | ||||
| JP8172340A | ||||
| JP4249904A | ||||
| JP6008826B2 | ||||
| JP6012623B2 | ||||
| JP2500238A | ||||
| JP7074610A | ||||
| JP48026011A | ||||
| JP64002412A |
Attorney, Agent or Firm:
Takashi Ishida
Shigeru Tsuchiya
Toshio Toda
Masaya Nishiyama
Higuchi Souji
Shigeru Tsuchiya
Toshio Toda
Masaya Nishiyama
Higuchi Souji