To provide a method and an apparatus for positioning and recognizing pickup of a semiconductor chip by which efficiency in pickup operation is improved.

The method is provided with a step of imaging a plurality of semiconductor chips 1 divided on a wafer with an ITV camera 6, a step of allowing an image processing part 8 to process image information obtained by this step to perform pickup positioning to an optional one nondefective chip, a step for discriminating whether the semiconductor chips except for this picked-up chip are nondefective or not during pickup operation by the mount head 2 of the nondefective chip positioned by this step, and a step of deciding the positional information of the other nondefective chips discriminated by this step.

COPYRIGHT: (C)2004,JPO