Title:
SEMICONDUCTOR DEVICE, CAMERA MODULE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2004103860
Kind Code:
A
Abstract:
To provide a semiconductor device which is reduced in size by forming resin bumps by making effective use of a bottom face (mounting-side face) region thereof, and also to provide a downsized camera module using the semiconductor device of such a structure.
On a mounting-side face of a molding resin 2 for sealing a semiconductor element 1, projecting portions 2a are formed. Then, on the mounting-side face of the molding resin 2, a metal film 3 is formed to form a pattern wiring. The metal film 3 is also formed on the projecting portions 2a to form the resin bumps 6. Immediately below a region where the semiconductor element 1 is mounted, resin bumps 6A are formed using projecting portions 4a formed of resin 4 for fixing the element.
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Inventors:
ONODERA MASANORI
MORIYA SUSUMU
KOBAYASHI IZUMI
AOKI HIROSHI
YODA TOSHIYUKI
MORIYA SUSUMU
KOBAYASHI IZUMI
AOKI HIROSHI
YODA TOSHIYUKI
Application Number:
JP2002264260A
Publication Date:
April 02, 2004
Filing Date:
September 10, 2002
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L21/48; H01L21/56; H01L21/68; H01L23/00; H01L23/12; H01L23/31; H01L25/10; H01L25/18; H01L27/146; H01L27/148; H01L31/0203; H04N5/335; (IPC1-7): H01L23/12; H01L25/10; H01L25/18; H04N5/335
Attorney, Agent or Firm:
Tadahiko Ito
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