Title:
SEMICONDUCTOR DEVICE AND COOLING METHOD FOR THE SAME
Document Type and Number:
Japanese Patent JP2015002291
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a structure of a semiconductor device and a cooling method for the semiconductor device capable of preventing reduction in cooling performance and leakage of a coolant due to clogging of a microchannel.SOLUTION: A semiconductor device includes: a laminate which is formed by laminating a first substrate having a microchannel and a second substrate having a semiconductor element; a first refrigerant introduction part which is joined to a first side surface of the laminate and used for introducing a coolant from the first side surface to the microchannel; a second refrigerant introduction part which is joined to a second side surface in contact with the first side surface of the laminate and used for introducing the coolant from the second side surface to the microchannel; and a refrigerant discharge part which is joined to a third side surface opposite to the first side surface of the laminate and used for discharging the coolant from the microchannel.
Inventors:
HIBINO SEIJI
MIZUNO YOSHIHIRO
MIZUNO YOSHIHIRO
Application Number:
JP2013126823A
Publication Date:
January 05, 2015
Filing Date:
June 17, 2013
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L23/473; H05K7/20
Domestic Patent References:
| JP2006049861A | 2006-02-16 | |||
| JP2010153785A | 2010-07-08 | |||
| JP2005079337A | 2005-03-24 | |||
| JPH02298054A | 1990-12-10 | |||
| JP2005166752A | 2005-06-23 | |||
| JPH04335598A | 1992-11-24 | |||
| JPH1168369A | 1999-03-09 | |||
| JP2001352025A | 2001-12-21 |
Foreign References:
| WO2012132019A1 | 2012-10-04 |
Attorney, Agent or Firm:
Kitano Yoshito
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