Title:
SEMICONDUCTOR DEVICE HAVING MUTUAL CONNECTION OF SUPERCONDUCTOR
Document Type and Number:
Japanese Patent JPH0199242
Kind Code:
A
Abstract:
PURPOSE: To ensure a relatively low electric contact by forming an interconnection with a first region of a superconducting material in a device including the interconnection. CONSTITUTION: A semiconductor device 1 includes a semiconductor chip 20 including a single IC. The chip 20 includes a substrate 40 containing a semiconductor material, i.e., silicon in which and out which an IC chip is formed. At least one of interconnections 500, 600, and 700 preferably includes a region 800 of a relatively high Tc superconducting material, e.g. a region of a material selected from one of two kinds of relatively high Tc superconducting copper oxides. Hereby, a relatively low electric contact is yielded.
Inventors:
MAIKERU GAABUTSUCHI
ROORANDO EE REBUI
ROORANDO EE REBUI
Application Number:
JP22487488A
Publication Date:
April 18, 1989
Filing Date:
September 09, 1988
Export Citation:
Assignee:
AMERICAN TELEPHONE & TELEGRAPH
International Classes:
H01L21/3205; H01L21/768; H01L23/498; H01L23/52; H01L23/532; H01L23/538; H01L39/06; (IPC1-7): H01L21/88; H01L23/52; H01L39/06
Domestic Patent References:
| JPS6427244A | 1989-01-30 | |||
| JPS6413743A | 1989-01-18 | |||
| JPS63263745A | 1988-10-31 |
Attorney, Agent or Firm:
Masao Okabe (3 others)
Next Patent: JPH0199243