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Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2017126774
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device which achieves downsizing in a plan view.SOLUTION: A semiconductor device includes: a die pad part 11 having die pad surfaces 111, 112 facing opposite sides; a semiconductor chip 41 disposed on the die pad surface 111; a semiconductor chip 42 disposed on the die pad surface 112; and a sealing resin part 7 covering the die pad surfaces 111, 112. The sealing resin part 7 includes: a resin part 71 covering the semiconductor chip 41; and a resin part 72 covering the semiconductor chip 42. The resin part 71 has a resin surface 713, and the resin part 72 has a resin surface 723 which contacts with the resin surface 713.SELECTED DRAWING: Figure 6

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Inventors:
KIMURA AKIHIRO
SUNAGA TAKESHI
YASUNAGA SHOJI
KOGA AKIHIRO
Application Number:
JP2017050910A
Publication Date:
July 20, 2017
Filing Date:
March 16, 2017
Export Citation:
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Assignee:
ROHM CO LTD
International Classes:
H01L23/29; H01L23/31; H01L23/50
Domestic Patent References:
JPH08124952A1996-05-17
JPH11204724A1999-07-30
JPH1093015A1998-04-10
JPH10214934A1998-08-11
JPH09270435A1997-10-14
JPH06112674A1994-04-22
JP2007165585A2007-06-28
JP2008084978A2008-04-10
JPH03278561A1991-12-10
Foreign References:
US20030227751A12003-12-11
Attorney, Agent or Firm:
Minoru Yoshida
Nao Usui



 
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