Title:
SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP3284853
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thin, compact, light and inexpensive semiconductor device which is excellent in heat dissipation function.
SOLUTION: A TAB tape is built in a package of this semiconductor device. An electrode of a semiconductor element 1 and a TAB tape inner lead 10, and a TAB tape outer lead 11 and a lead frame inner lead 3 are connected with each other. The surface with an electrode of the semiconductor element 1 and its opposite surface are fixed to a heat sink 8. A part wherein a semiconductor element of a heat sink is fixed is provided with a recess 14 which constitutes a plane which is larger than a plane area of a semiconductor element. According to this constitution, it is possible to further thin a semiconductor device.
Inventors:
Tokata Hama
Application Number:
JP27416595A
Publication Date:
May 20, 2002
Filing Date:
October 23, 1995
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H01L21/60; H01L21/56; H01L23/28; (IPC1-7): H01L23/28
Domestic Patent References:
| JP4236434A | ||||
| JP4364762A | ||||
| JP5257570A | ||||
| JP7122586A | ||||
| JP388350U |
Attorney, Agent or Firm:
Masataka Ueyanagi
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