Title:
SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPS5851525
Kind Code:
A
Abstract:
PURPOSE:To redouble the density of mounting in case of mounting to a printed wiring board by increasing the number of the ribbon frames of the package of the semiconductor device. CONSTITUTION:The first ribbon frame 7 and the second ribbon frame 9 are bonded by adhesives. A semiconductor chip 10 is die-bonded to either one of the ribbon frames. The bonding spaces of the frames 7, 9 wire-bonded with the chip 10 and the frames 7, 9 are formed in stepped shape. Accordingly, wires 13, 14 can be stretched in structure as two-storied building when the end sections of the frames 7, 9 and the chip 10 are connected by the wires.
Inventors:
SAGARA IWAO
TANAKA SEIETSU
TANAKA SEIETSU
Application Number:
JP14881981A
Publication Date:
March 26, 1983
Filing Date:
September 22, 1981
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L23/50; H01L21/60; (IPC1-7): H01L23/48
Domestic Patent References:
| JPS50147667A | 1975-11-26 |
Attorney, Agent or Firm:
Toshiaki Suzuki
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