Title:
SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, SEMICONDUCTOR WAFER, CIRCUIT BOARD, AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP3945415
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device, its manufacturing method, a circuit board, and an electronic apparatus.
SOLUTION: A resin layer 20 is formed on a semiconductor substrate 10 constituted of forming a plurality of integrated circuits 12. A plurality of recessed parts 22 are formed on the surface of the resin layer 20. Wiring 40 is formed so as to be passed through any one of the recessed parts 22. The semiconductor substrate 10 is cut off to a plurality of semiconductor chips. Respective recessed parts 22 are formed so that their aperture width is shorter than the thickness of the wiring 40 and has depth ≥1 μm.
Inventors:
Haruki Ito
Application Number:
JP2003036143A
Publication Date:
July 18, 2007
Filing Date:
February 14, 2003
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H01L23/12; H01L23/52; H01L21/301; H01L21/3205; H01L21/60; H01L21/78; H01L23/28; H01L23/31; H01L23/485; (IPC1-7): H01L23/12; H01L21/301; H01L21/3205
Domestic Patent References:
| JP11145619A | ||||
| JP11191604A | ||||
| JP2001144217A | ||||
| JP2003007701A |
Attorney, Agent or Firm:
Yukio Fuse
Mitsue Obuchi
Mitsue Obuchi
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