PURPOSE: To obtain a semiconductor device which can be mounted on a plurality of printed-circuit boards which are not situated on an identical plane by a method wherein leads are extracted from at least two sides or more of side faces of a main body.
CONSTITUTION: Leads 5b, 5c are extracted from at least two sides or more of side faces of a main body 1 or of faces perpendicular to the surface of a semiconductor element. The shapes of their tip parts are deformed in such a way that the leads 5b, 5c are situated on planes different from those connecting roots extracted from the side faces of the main body 1 and that they are situated on planes parallel to the planes. In other words, the leads 5b, 5c are stretched, in a shape of a ZIL(zigzag in-line) type package, from two faces or more of the side faces of the semiconductor device main body 1. Thereby, it is possible to mount the semiconductor device 1 over two printed- circuit boards or more which are not situated on an identical plane.
TACHIKAWA TORU
TAKEHARA KATSUNAO
