Title:
SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH06291233
Kind Code:
A
Abstract:
PURPOSE: To enable a semiconductor device which can be mounted on a circuit board in a vertical surface mounting manner to be enhanced in heat dissipating properties.
CONSTITUTION: A first semiconductor chip is mounted on a stage 6, a second and a third semiconductor chip, 8 and 9, are mounted on the surface of the first semiconductor chip, the semiconductor chips are sealed up with resin into a package 1, a part of the stage 6 is extended out of the package 1 to serve as a heat dissipating plate 4, the rear of the stage 6 where the first semiconductor chip is mounted and the rear sides of the semiconductor chips 8 and 9 are exposed out of the front surface of the package 1.
Inventors:
KUSAMA YASUHIKO
SATO MITSUTAKA
YOSHIMOTO MASANORI
SATO MITSUTAKA
YOSHIMOTO MASANORI
Application Number:
JP7793393A
Publication Date:
October 18, 1994
Filing Date:
April 05, 1993
Export Citation:
Assignee:
FUJITSU LTD
SHINKO ELECTRIC IND CO
SHINKO ELECTRIC IND CO
International Classes:
H01L23/34; H01L23/50; H05K13/04; H05K3/30; H05K3/34; (IPC1-7): H01L23/50; H01L23/34; H05K13/04
Attorney, Agent or Firm:
Teiichi