Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2001339041
Kind Code:
A
Abstract:
To provide a semiconductor device where a semiconductor elements such as a power semiconductor element, or a control semiconductor element, are connected by means of a lead frame, improvement of electric characteristics and miniaturization of a device can be realized without breakdown of an electrode connection part caused by stress concentration during resin sealing and high producibility can be attained, and to provide a manufacturing method of a semiconductor device.
At least the places of lead frames 6, 28, which are connected with element formation surface side electrodes 11c, 36c of control semiconductor elements 5, 26 by solders 8, 31, are made thinner than other places.
Inventors:
TSUDA TATSUYA
SAITO YASUTO
HORI TETSUJI
YOSHIOKA SHINPEI
SAITO YASUTO
HORI TETSUJI
YOSHIOKA SHINPEI
Application Number:
JP2000158811A
Publication Date:
December 07, 2001
Filing Date:
May 29, 2000
Export Citation:
Assignee:
TOSHIBA DIGITAL MEDIA ENG
TOSHIBA CORP
TOSHIBA CORP
International Classes:
H01L25/07; H01L25/18; (IPC1-7): H01L25/07; H01L25/18
Attorney, Agent or Firm:
Norio Ogo (2 outside)
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