Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING OF THE SAME AND A MOLDING APPARATUS USED FOR MANUFACTURE
Document Type and Number:
Japanese Patent JPH0411755
Kind Code:
A
Abstract:
PURPOSE: To prevent flow of bonding wire by a resin by molding a resin sealing package with a pressure molding method and locating the gate toward the center of radial wires.
CONSTITUTION: A heated and molten resin 45 is supplied with pressure to each cavity 40 from a pot 34 by a plunger 35 through a runner 37 and a gate 38. Thereby, a resin sealed package is formed. In this case, since the gate 38 is provided at the center of cavity 40, the resin 45 pressurized to the cavity 40 from the gate is radially diffused along each wire 26 from the center of cavity 40 to fill it. Therefore, flow of wire 26 by the resin 45 is prevented.
Inventors:
YAMADA TOMIO
OKA HIROTAKE
NAKAMURA ATSUSHI
NISHI KUNIHIKO
YAMAZAKI KAZUO
KOIZUMI KOJI
SAEKI JUNICHI
OKA HIROTAKE
NAKAMURA ATSUSHI
NISHI KUNIHIKO
YAMAZAKI KAZUO
KOIZUMI KOJI
SAEKI JUNICHI
Application Number:
JP11486690A
Publication Date:
January 16, 1992
Filing Date:
April 27, 1990
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/56; H01L23/04; H01L23/28; (IPC1-7): H01L23/28
Attorney, Agent or Firm:
Kajiwara Tatsuya
Next Patent: SEMICONDUCTOR CIRCUIT SUBSTRATE