To easily secure an optical accuracy by preventing moisture condensation, and by preventing the tilt of a semiconductor chip, in a light receiving semiconductor device.
A surface of a semiconductor chip 2 for a hollow package 5 to be mounted on is formed with a recess 2b, the bottom of the semiconductor chip 2 and the recess 2b thereof is filled with an interlocking agent 4 having a moisture absorbing material added thereinto, and the semiconductor chip 2 is fixed by the interlocking agent 4 onto the bottom surface of the hollow package 5. With such an arrangement, since the amount of such interlocking material 4 can be partially increased, an optical accuracy is easily secured by preventing moisture condensation of the semiconductor chip 2 and the tilt thereof.
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MARUMO SHINYA
Yoshihiro Morimoto
Toshiji Sasahara
Yohei Harada