To alleviate displacement between a semiconductor element and an electrode, the displacement being caused by a dimensional change of a wiring board in bare chip mounting by flip chip or ILB such as COF.

The wiring board 1 includes a first bonding wiring array 9 that is formed by extending conductor wirings 2, and that extends from an external side of a semiconductor element region and is bonded individually to a first element electrode array 5 of the semiconductor element 4, and a second bonding wiring array 10 that extends from the external side of the semiconductor element region and is bonded individually to a second element electrode array 7 of the semiconductor element. A pitch of the individual conductor wirings constituting the first bonding wiring array varies continuously so as to be wider than a pitch of the first element electrode array on the external side of the semiconductor element region and narrower than that of the first element electrode array at a front end on a center side of the semiconductor element, and a pitch of the individual conductor wirings constituting the second bonding wiring array varies continuously so as to be narrower than a pitch of the second element electrode array on the external side of the semiconductor element region and wider than that of the second element electrode array at a front end on the center side of the semiconductor element.